THERMAX
Compact modular design
Patented fabrication process ensures consistent, high quality production. Manifolding is simplified for larger applications. No gaskets to fail. TIG welding is used on the sheet edge (which separates Circuit A from Circuit B). Offers easy installation and servicing. Manifolding is simplified for larger applications. Heat loss is low, requiring little or no insulation. Standard unit is 316 Stainless Steel. Titanium available as an option.
Maximum single circuit capacity 76 fluid ounces (2.2 liters). Temperature range: -60°F (-50°C) to 480°F (250°C)
Seven sizes from 1.1 ft2 (.10 m2) to 15 ft2 (1.4 m2). Compact cylinders from 3” (70mm) x 6” (158mm) to 5” (120mm) x 20” (515mm).
Applications
* Semiconductor Wafer Cleaning
